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The 95,000sqm facility will produce advanced substrates for AI, networking, and next-generation computing, with more than 200 engineers and skilled technicians already hired since 2004.
Advanced Substrate Technologies (AST) has officially opened Singapore’s first manufacturing facility capable of producing high-end Flip Chip Ball Grid Array (FC-BGA) substrates, according to a press release issued by the company on the Economic Development Board (EDB)'s website.
The facility is the first such site outside Japan for the TOPPAN Group, as demand for advanced substrate capacity continues to grow alongside AI, networking, and next-generation computing.
AST is a joint venture between TOPPAN Holdings and Broadcom.
At the opening ceremony, AST executives and partners from the TOPPAN Group and Broadcom welcomed Gan Kim Yong, Deputy Prime Minister and Minister for Trade and Industry (Trade), alongside other partners and guests.
Facility supports growing AI and data centre demand
The approximately 95,000-square-metre facility is located in the Jurong Lake District and is designed to support growing demand for generative AI and data centres in the region. It will manufacture large-body, high-layer-count substrates for advanced semiconductor products, including AI compute and networking devices.
The facility incorporates sustainability features such as solar panels and advanced water recycling technologies.
The Singapore production base will complement TOPPAN’s main production hub in Niigata, Japan. It will also house R&D capabilities to support future performance requirements and work with technology institutions in Singapore.
Yoshiyuki Iida, CEO, AST said the facility’s ability to produce large-body, high-layer-count substrates to TOPPAN’s standards would help address a bottleneck in AI and networking chip production. He added that the investment reflects TOPPAN and Broadcom’s long-term commitment to Singapore as part of their global manufacturing network.
More than 200 engineers and technicians hired
Since breaking ground in March 2024, AST has hired more than 200 high-tech engineers and skilled technicians, in addition to operational personnel in Singapore. The company will continue recruiting for engineering and technical roles as it prepares to scale manufacturing operations.
The facility will also support R&D activities, with AST working closely with technology institutions in Singapore to develop capabilities for future semiconductor requirements.
Satoshi Oya, President & COO, TOPPAN Holdings said Singapore remains an important location for the company as AI adoption accelerates and demand for advanced semiconductor packaging grows.
EDB and JTC support facility development
The project is supported by Singapore’s EDB and JTC Corporation.
Png Cheong Boon, Chairman, Singapore EDB said the facility will strengthen Singapore’s capabilities in advanced substrates, which are a critical enabler for advanced packaging and an important part of the global semiconductor value chain.
He added that EDB: “EDB will continue to work with both companies and AST to build new capabilities to support global demand for semiconductors, and create new jobs and opportunities here."
Jacqueline Poh, Chief Executive, JTC Corporation noted on the importance of advanced substrates as AI and high-performance computing drive demand, and said that JTC will continue working with industry partners on infrastructure for next-generation semiconductor manufacturing, she added.
Broadcom cites supply chain resilience
Broadcom, TOPPAN’s largest customer for FC-BGA substrates, has closely supported the development of the facility.
The company said the additional large-body, high-layer-count substrate capacity is important to its next-generation AI compute and networking product roadmap.
Charlie Kawwas, President, Semiconductor Solutions Group, Broadcom said the Singapore facility provides greater flexibility as demand for AI and networking silicon continues to increase.
The facility was also brought online three months ahead of schedule, according to Broadcom.
High-value manufacturing targeted for late 2026
AST’s facility is targeting the start of high-value manufacturing by late 2026. The company will work with TOPPAN and Broadcom to scale output as demand for advanced substrates grows.
“Thanks to the exceptional execution by TOPPAN and AST, alongside the continued partnership of the Singapore EDB, this facility will deliver the next generation of large-body, high-layer-count substrates that Broadcom requires to further scale global AI infrastructure,” said Kawwas.
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Lead image / EDB
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